Optical Profilometry (OP)
Optical profilometry (OP) is a non-contact interferometric-based method for characterizing surface topography. A typical OP analysis provides 2D and 3D images of a surface, numerous roughness statistics, and feature dimensions. In addition to these standard measurements, Evans Analytical Group® (EAG) can 
also perform many advanced OP analyses with a state-of-the-art Bruker Contour GTX-8 3D optical microscope. These include:
- Analysis automation for high-throughput measurements of several hundred features on a single sample, such as patterned wafers or die features
- The instrument can be used to determine the thickness of transparent, continuous films.
OP is suitable for numerous applications and sample types because it can accommodate many sample geometries, offering 
a wide range of possible analysis dimensions and a versatile Z-range, covering a broad range of potential surface roughnesses. EAG is committed to working with our clients to develop unique approaches for characterizing the topographies of even the most challenging samples.
- Step height and dimensional measurement
- Characterizing wear and friction of mechanical parts
- Determining consistency of solder bump heights, e.g. on flip chips and other advanced packaging
- Correlating roughness measurements with materials properties, e.g. adhesion, corrosion, appearance
- Measuring the radius of curvature of microfluidic channels, optics, etc.
- Assessing bow on coated/processed wafers, e.g. MEMS fabrication
- Quantifying thickness of continuous SiO2 films (i.e. no physical step is needed)
- High-throughput screening of multiple features on a die or wafer
Lateral Resolution: 0.5μm (best)
Height Resolution: 0.2nm (PSI) or 0.2mm (VSI)
Maximum feature height: 10mm
Minimum image size: 0.06×0.047mm2
Maximum image size: 2.2×1.1mm2 (single image); 70x70mm2 (stitched images)
Maximum sample size: 300mm diameter, 100lbs weight, 4"/100mm height
Film Thickness: Between 150µm and 2µm thick
- Wide range of possible analysis areas, feature heights, and roughnesses
- Accommodates very large and very small sample sizes
- Non-destructive/non-contact
- Rapid
- Potential for optical artifacts on certain sample types
- Poor signal detection for very steep and rough surfaces
- Films must be transparent and of known refractive index for continuous film thickness measurements
- Semiconductor Equipment
- Semiconductor Manufacturing
- Transportation: rail, aviation, automotive etc.
- Coatings
- Alternative energy: solar, wind etc.
- Advanced materials
- Electronics/microelectronics
- Medical devices, implants
- Medical/diagnostic equipment
- Biotechnology
- Advanced displays
- Consumer goods: electrical appliances, packaging, electronics
- Aerospace/Defense
- Lighting/LED
- Data Storage
- Oil and gas industry: test equipment, drilling equipment, subsea equipment
