Secondary Ion Mass Spectrometry, SIMS Analysis
Secondary Ion Mass Spectrometry (SIMS) detects very low concentrations of dopants and impurities. It can provide elemental depth profiles over a depth range from a few angstroms (Å) to tens of microns (µm). The sample of interest is sputtered/etched with a beam of primary ions (usually O or Cs). Secondary ions formed
during the sputtering process are extracted and analyzed using a mass spectrometer (usually a quadrupole or magnetic sector). The secondary ions can range in concentration from matrix levels down to sub-ppm trace levels.
Evans Analytical Group® (EAG) is the industry standard for
commercial SIMS analysis, offering the best detection limits along with accurate concentration and layer structure identification. EAG's depth and breadth of experience and dedication to research and development in the SIMS field is unmatched. EAG has the largest range of SIMS instruments worldwide (more than 40), staffed by highly qualified scientists. EAG also has the world's largest reference material library of ion-implanted and bulk-doped standards for accurate SIMS quantification.
EAG's analysts are adept at understanding our client's needs and designing relevant analyses to most effectively address their concerns and interests. EAG regularly uses SIMS analysis to help customers across a range of industries with R&D, quality control, failure analysis, troubleshooting, and process monitoring. EAG provides person-to-person service throughout the process, to allow a full understanding of the test results.
EAG's SIMSview™: SIMS Data Processing Software
- Dopant and impurity depth profiling
- Composition and impurity measurements of thin films (metals, dielectrics, SiGe, III-V, and II-V materials)
- Ultra-high depth resolution profiling of shallow implants and ultra thin films (ULE implants and gate oxides)
- Bulk analyses, including B, C, O, and N in Si
- High-precision matching of process tools, such as ion implanters
Signal Detected: Secondary Ions
Elements Detected: H-U including isotopes
Detection Limits: >1010-1016at/cm3
Depth Resolution: >5Å
Imaging/Mapping: Yes
Lateral Resolution/Probe Size: >=10µm (depth profiling); 1µm (imaging mode)
- Excellent detection sensitivity for dopants and impurities, with ppm or lower detection sensitivity
- Depth profiles with excellent detection limits and depth resolution
- Small-area analysis (10µm or larger)
- Detection of all elements and isotopes, including H
- Excellent dynamic range (up to 6 orders of magnitude)
- Stoichiometry/composition possible, in some applications
- Destructive
- No chemical bonding information
- Element specific
- Sample must be solid and vacuum compatible
- Semiconductors
- Aerospace
- Automotive
- Compound Semiconductor
- Data Storage
- Defense
- Displays
- Electronics
- Lighting
- Photonics
- Photovoltaics/Solar
- Telecommunications
Related Application Notes
- Chemical Imaging of Pharmaceuticals AN466
- CdTe Thin Film PV - Application Discussion BR047
- CIGS Thin Film PV - Application Discussion BR045
- High Resolution X-ray Diffraction (HR-XRD) Measurement of Substitutional Carbon in Silicon AN460
- High Resolution X-ray Diffraction (HR-XRD) Measurement of Compound Semiconductors AN458
- SIMS Analysis of C, O and N in Solar-Grade Silicon AN456
- Characterizing Annealed ULE B Implants using EAGLABS PCOR-SIMS AN434
- Measuring Ultra-low Energy Boron Implants using EAGLABS PCOR-SIMS AN438
- Measuring Cluster Ion Implants using EAGLABS PCOR-SIMS AN449
- Uniformity Study of B, Al, P, C, O, Ca and Fe in Upgraded Metallurgical Grade Silicon (UMG-Si) by SIMS AN452
- Measuring B Implants Produced by Plasma Ion Implantation using EAGLABS PCOR-SIMS AN448
- SIMS Detection Limits for Selected Impurities in Si Bulk Conditions AN444
- Accurate Dosimetry for High Dose Plasma Implanted Boron using EAGLABS PCOR-SIMS AN435
- Advanced Surface Analysis for Problem-Solving in Flat Panel Display Manufacturing AN443
- Identification of Precipitates in Biological Tissue BN1505
- Imaging Cross-Sections by TOF-SIMS BN1355
- Microtomy Advantages for Cross-sectioning Materials BN1399
- SiC 4" Whole Wafer Analysis AN436
- SIMS Analysis of Individual Particles in SiC Powder Sample AN437
- SIMS Characterization of HgCdTe Epilayer Structure AN442
- Advanced SiGe SIMS Analyses, As in SiGe AN359
- Backside SIMS AN418
- Characterization of Amorphous Silicon Using Secondary Ion Mass Spectrometry (SIMS) AN427
- Characterization of Surface Aluminum Contamination on Processed Silicon Wafers Using SurfaceSIMS.XP AN393
- Depth Profile Characterization of Low-K Materials Using Secondary Ion Mass Spectrometry AN433
- Detection Limits for Surface Metals on Patterned Wafers Using SurfaceSIMS AN428
- High Depth Resolution SIMS of Strained Si in Si/SiGe AN408
- High Depth Resolution SIMS Profiles for Compound Semiconductor Devices AN374
- Improved Characterization of Diffusion in Ohmic Contacts on an AIGaAs Laser Diode using Backside SIMS AN386
- Improved Characterization of Interface Contamination in a Laser Diode using Backside SIMS AN387
- Improved Detection Limits in SIMS Measurements of SiC AN358
- Improved Precision in SIMS Measurements of B, Al, and N in SiC AN357
- N Distribution in SiON Gate Dielectrics Using TOF-SIMS AN414
- Organic Contamination on Surfaces AN378
- Process Control Using SIMS for Compound Semiconductors AN373
- Proper SIMS Quantification of Boron in SiGe structures: Comparison of Cs and O Ion Beam Bombardment AN401
- Residual Copper Analysis on CMP Wafers AN361
- Reverse Engineering of Compound Semiconductor Optoelectronics AN419
- SIMS Analysis of Small Area Device Samples AN343
- SIMS Analysis of Small Area SiGe Device Samples AN360
- SIMS Detection Limits of Selected Elements in GaAs Under Normal Depth Profiling Conditions AN371
- SIMS Detection Limits of Selected Elements in GaN Under Normal Depth Profiling Conditions AN370
- SIMS Detection Limits of Selected Elements in InP Under Normal Depth Profiling Conditions AN369
- SIMS Detection Limits of Selected Elements in ZnO Under Normal Depth Profiling Conditions AN426
- SIMS Measurement of Bulk [N] in Nitrogen-doped Cz-Si: Long Term Precision Results AN411
- • SIMS Quantification for Compound Semiconductors AN372
- TXRF and SURFACESIMS.XP The Total Solution For Surface Contamination Measurements AN363
- Whole Wafer Analysis Using TOF-SIMS AN368
- Characterization Methods for Copper Technology AN192
- Cleanroom Materials as Sources of Airborne Molecular Contamination AN182
- SIMS Detection Limits of Selected Elements in HgCdTe Under Normal Depth Profiling Conditions AN338
- SIMS Detection Limits of Selected Elements in Si and SiO2 Under Normal Depth Profiling Conditions AN339
- SIMS Detection Limits of Selected Elements in SiC Under Normal Depth Profiling Conditions AN337
- Surface Metal Contamination on Patterned Wafers AN221
Related Brochures
- PCOR-SIMS - Improved Profile Accuracy
- EAGLABS Bubble Chart: Analytical Resolution versus Detection Limit BR004
- Materials Characterization Brochure
- PV Materials Characterization for CIGS BR053
- PV Silicon Impurity Analysis BR025
- LED Brochure BR061
- Materials Characterization for Lithium Ion Battery Technology BR057
- PV Materials Characterization for CdTe BR054
- Typical Applications for Techniques / Periodic Table of Elements BR038
- Biomedical Service Brochure BR003
- Amorphous & MicrocrystallineThin Film PV - Application Discussion BR046
- III-V Multi-Junction PV - Application Discussion BR048
- PV Si Feedstock Evaluation - Application Discussion BR043
- Silicon Wafer PV - Application Discussion BR044
- EAGLABS Secondary Ion Mass Spectrometry (SIMS) Services TN103
- EAGLABS Time-of-Flight SIMS (TOF-SIMS) Services TN104
- Your Solution for PV Materials Characterization BR032
- Compound Semiconductor High Speed Electronics - SIMS Analytical Services BR009
- Compound Semiconductors for Optoelectronics - SIMS Analytical Services BR010
- Contamination Analysis for Compound Semiconductors - Analytical Services BR006
- EAG Services Introduction BR011
- EAG Technique Chart BR008
Related Papers
- Characterization of Solar Grade Silicon Contaminants
- Quantitative Measurement of Dopants (sub-ppba), Oxygen and Carbon (sub-ppma), and Metals (sub-ppma) in PV Si Feedstock and Wafers by SIMS PS715
- SIMS Measurements of Silicon Carbide PS712
- SIMS Measurements of Metal Contamination in SOI - M.H. Yang; A. Wang; M. Neuburger; R.S. Hockett PS707
- TOF-SIMS Imaging Applications in the Pharmaceutical and Food Industries - K. Wolf PS711
- Characterization of Amorphous Silicon by Secondary Ion Mass Spectrometry - Y. Li; S. Wang; X. Lin; L. Wei PS701
- Characterization of P-type Dopants in III-Nitrides by SIMS - R.S. Hockett; P. Van Lierde; C. Tian PS703
- Measurements of Ti-Containing Barrier Materials and Low-K Dielectric Films Using Backside Polishing SIMS - M.H. Yang; J. Lan; I. Mowat; R. Humayun; J. Sun PS706
- SIMS Analysis of Nitrogen in Various Metals and ZnO - Y. Li; S. Wang; S.P. Smith PS708




