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Advanced Microscopy Services: TEM, SEM, Dual Beam FIB
The Microscopy group includes staff and equipment to perform FESEM (Field Emission Scanning Electron Microscopy), which is used for surface structural and cross-sectional analysis of integrated circuits. EDX (Energy Dispersive X-Ray Spectroscopy) is used to perform Elemental materials analysis, both qualitative and quantitative. FETEM (Field Emission Transmission Electron Microscopy) is used to perform microanalysis with sub-nanometer spatial resolution.
Please click here to learn about EAG's EMview software for SEM, FIB, TEM, and STEM data processing and display.
