EAG Application Solutions for Failure Analysis

Failure analysis is an investigation into the background or history of a sample or an event to determine why a particular failure occurred. This can involve analyzing the sample as it currently exists and extrapolating from that data what may have caused the failure. Potential use scenarios include physical failures (poor adhesion, pull strength, fractures) and electrical failures, as well as more complex analyses that examine root causes by tracing the various steps in a manufacturing flow.

The scenario and sample type impact which analytical technique you choose. Electronic device failures (including their packaging) are usually investigated using ion or electron beam imaging techniques, such as Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Spectroscopy (EDS), Focused Ion Beam (FIB), and Auger Electron Spectroscopy (AES). Since these techniques typically look at the failure’s physical appearance and take microscopic images of the lateral distribution of material at the failure site, they can often detect the presence of foreign material or anomalous distribution of elemental species. Failure analysis on electronic devices using these characterization methods can compliment electrical testing and other data, providing a more thorough analysis.

If you are dealing with an adhesion or bonding failure, Fourier Transform Infrared Spectroscopy (FTIR), Time-of-flight Secondary Ion Mass Spectrometry (TOF-SIMS), and X-ray Photoelectron Spectroscopy (XPS) are important techniques that provide information about the molecular species at the failure site. In some instances, the presence of molecular contaminants at delaminated surfaces can indicate poor contact between the bonded surfaces. Imaging delaminated surfaces can also indicate the failure mechanism (i.e., cohesive or adhesive).

Other failure analysis scenarios may involve analyzing unknown materials or investigating the unexpected appearance of materials on a surface.

Secondary Analytical Techniques

• FTIR
• SIMS
• TOF-SIMS
• XPS
• XRD

Application Notes