Decapsulation

Decapsulation (Decap) is a necessary step in the Failure Analysis or modification of packaged devices. Decap is performed by using acids, or mixtures of acids, at elevated temperatures. A successful Decap will expose the integrated circuit while maintaining the electrical connections to the pins, allowing for FIB circuit editing, photon emission, liquid crystal or other Failure Analysis process to be completed.

Decapsulation, or Decap, is a preparation technique that exposes a die from a package to allow further investigations to be performed. The decap is done by using nitric and/or fuming sulfuric acid at controlled temperatures. Done successfully, decap leaves the integrated circuit exposed and completely operational. At Evans Analytical Group® (EAG) we have many years of experience and libraries of recipes to ensure that your decap requests lead to high quality, clean and operational die. We have been in the Decap business since 1996. Our newest generation tool can handle most types of packages including:

• High-density micro BGAs
• FPBGAs
• High-density die down BGAs
• Multi-die BGAs
• Stacked Chip BGAs
• CSPs
• Multi-die CSPs
• Stacked Chip CSPs

At EAG, after your decap is done, we can help you with your next step. We have fantastic FIB Circuit edit, SEM, Parallel lapping, Auger and TEM groups to help you characterize or edit your chip. Our engineers have a wealth of experience to help you be successful in your FA, Yield or Process improvement projects.