Failure Analysis for Integrated Circuits

EAG provides failure analysis services in support of our client’s commitment to achieve high quality, reliable products at a reasonable cost. Our commitment to this goal has been repeatedly demonstrated by providing services designed to compliment your internal lab capabilities or to provide full outsourced failure analysis. EAG has optimized service offerings to provide you with the maximum value, fast response, wide array of analytical tools, and extensive product and system level knowledge. EAG is an integrated laboratory with an unmatched knowledge base that is accessible to all of our clients.

We provide a complete line of failure analysis services for IC devices, packaged devices and printed circuit boards including electrical tests, electrical failure isolations, physical failure isolation, reverse engineering and construction analysis. A wide range of techniques are used including EMMI, OBIC, CSAM, Xray, LIVA/TIVA, and many others.

Failure Analysis Tools and Techniques

EAG builds strong relationships and confidence with our clients and starts with engineer-to-engineer interaction to discuss and understand your goals, objectives and urgency. Beginning with failure verification, EAG has a wide range of tools available for examining the failed device.

• Electrical Analysis
• Package Integrity
• Decapsulation
• Optical Inspection
• Fault Isolation
• Physical Analysis
• Additional Services

Comprehensive Outsourced Failure Analysis Services

EAG understands the challenges, difficulties and the costs of having a leading edge Failure Analysis laboratory. Our engineers are knowledgeable in many of today’s leading product technologies and we are experts in failure analysis.

Levels of Service

The ultimate goal in failure analysis is to arrive at an accurate determination of the cause of failure. EAG has developed a proven process of failure analysis that is efficient but can be customized for the needs of our clients. For all levels of effort, EAG uses advanced tools and techniques coupled with expert interpretation to provide our clients with significant insight into the investigation and product failure.

• Level 1 - A majority of package defects and electrical over stress (EOS) mechanisms can be identified during this fast initial investigation. The scope of the analysis includes failure verification, non-destructive package integrity examination, package decapsulation, and internal visual examination.
• Level 2 - This stage of the investigation is used to isolate and localize the failure or defect site. Fault isolation techniques help pinpoint the fault to a specific site on a sample, providing valuable failure information to a design, product, or package engineer.
• Level 3 - Defined as a ‘full’ analysis, our FA experts follow a proven methodology to properly identify and characterize the failure mechanism. This comprehensive analytical evaluation is designed to determine the root cause.